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Piezoelectric element package in which a piezoelectric element on a chip carrier is reliably shielded by using a cap
Piezoelectric element package in which a piezoelectric element on a chip carrier is reliably shielded by using a cap
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机译:压电元件封装,其中使用盖可靠地屏蔽了芯片载体上的压电元件
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摘要
A piezoelectric element package includes a chip carrier having a shielding surface and a cavity for enclosing a piezoelectric element therein, and a cap having a central axis and a shielding material on a bottom surface of the cap, the cap shielding the piezoelectric element, enclosed in the cavity of the chip carrier, with the shielding material bonded to the shielding surface of the chip carrier. The cap is in a substantially circular shape and the shielding material of the cap and the shielding surface of the chip carrier are bonded to each other such that a bonding area between the shielding material and the shielding surface is unchanged.
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