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Method for inhibiting the electrodeposition of organic particulate matter on copper foil
Method for inhibiting the electrodeposition of organic particulate matter on copper foil
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机译:抑制有机微粒物质在铜箔上电沉积的方法
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摘要
The invention relates to a process for electrolytic treatment of copper foil, comprising the steps of: (A) applying a voltage across an anode and cathode, wherein the anode and cathode are in contact with an electroplating composition containing a gelatin component; (B) removing organic particulate matter by contacting the electroplating solution containing the organic particulate matter with an adsorbent polymer; and (C) electrolytically treating the copper foil. The electroplating composition can additionally contain an active sulfur-containing component, such as thiourea.
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