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Non-hypercube interconnection subsystem having a subset of nodes interconnected using polygonal topology and other nodes connect to the nodes in the subset

机译:非超立方体互连子系统,其子集的节点子集使用多边形拓扑互连,而其他节点则连接到该子集中的节点

摘要

Interconnection subsystems having diverse topologies are disclosed for interconnecting small numbers of nodes having a predetermined maximum degree in a multiprocessor computer system. The interconnection subsystems are generally classified into three diverse classes of topologies, including a "polygonal" class, a "ladder" class and a "tiled" class. In topologies of the polygonal class, a majority of the nodes in the multiprocessor computer system are connected in a ring and the remaining nodes are connected to the nodes in the ring, and in some cases also to each other. In topologies of the ladder class, the nodes are interconnected in a "ladder" topology comprising a series of nodes connected in a ring, the ring corresponding to one standard of a ladder topology folded on itself. Each node in the ring is connected to another node in a second series, effectively forming rungs of the ladder topology. The nodes in the second series can be interconnected in a variety of arrangements, including a second ring, thereby effectively providing a second standard of the ladder topology. In topologies of the tiled class, the nodes are interconnected in tiled mesh-like topologies with six nodes for each mesh element, thereby providing a hexagonal or elongated "brick- like" non"square" rectangular arrangement. Edges of the mesh are preferably connected together to provide a folded toroid-like arrangement.
机译:公开了具有各种拓扑的互连子系统,用于互连多处理器计算机系统中的具有预定最大程度的少量节点。互连子系统通常分为三种不同的拓扑类别,包括“多边形”类别,“梯形”类别和“平铺”类别。在多边形类的拓扑中,多处理器计算机系统中的大多数节点连接成环,其余节点连接到环中的节点,在某些情况下还彼此连接。在阶梯类的拓扑中,节点以“阶梯”拓扑互连,该“阶梯”拓扑包括以环形连接的一系列节点,该环对应于折叠在其自身上的阶梯拓扑的一个标准。环中的每个节点都连接到第二个系列中的另一个节点,从而有效地形成梯形拓扑的梯级。第二系列中的节点可以以包括第二环的各种布置互连,从而有效地提供梯形拓扑的第二标准。在平铺类别的拓扑中,节点以平铺网格状拓扑互连,每个网格元素具有六个节点,从而提供了六边形或细长的“砖状”非“正方形”矩形布置。网格的边缘优选地连接在一起以提供折叠的环形结构。

著录项

  • 公开/公告号US5859983A

    专利类型

  • 公开/公告日1999-01-12

    原文格式PDF

  • 申请/专利权人 SUN MICROSYSTEMS INC;

    申请/专利号US19960675629

  • 发明设计人 GUY L. STEELE JR.;STEVEN K. HELLER;

    申请日1996-07-01

  • 分类号G06F13/00;

  • 国家 US

  • 入库时间 2022-08-22 02:08:54

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