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Surface-mounted module which permits the light output of an optical semiconductor device mounted thereon to be increased, and a method of producing the surface-mounted module

机译:允许增加安装在其上的光半导体器件的光输出的表面安装模块及其制造方法

摘要

A surface-mounted module (1) having an optical semiconductor device (5) and an optical fiber (6) mounted on a substrate (2) and a method of producing the surface mounted-module. The substrate (2) of the surface- mounted module (1) comprises a base component (3), which has marks (3b) indicative of the mounting position for an optical semiconductor device and a positioning section (3c) for positioning an optical fiber and is formed by a precision transfer process, and a molded body (4) joined integrally to the base component.
机译:具有安装在基板(2)上的光半导体装置(5)和光纤(6)的表面安装模块(1)及其制造方法。表面安装模块(1)的基板(2)包括基础组件(3),基础组件(3b)具有指示光半导体器件安装位置的标记(3b)和用于定位光纤的定位部分(3c)并通过精密转印工艺形成,并且模制体(4)一体地结合到基础部件上。

著录项

  • 公开/公告号US5861637A

    专利类型

  • 公开/公告日1999-01-19

    原文格式PDF

  • 申请/专利权人 THE FURUKAWA ELECTRIC CO. LTD.;

    申请/专利号US19970836008

  • 发明设计人 ISAMU OISHI;

    申请日1997-05-06

  • 分类号H01L33/00;

  • 国家 US

  • 入库时间 2022-08-22 02:08:53

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