Method and apparatus for protecting functions imbedded within an integrated circuit from reverse engineering

摘要

The present invention provides an integrated circuit chip having one or more circuit elements that perform a desired circuit function with the circuit elements being encompassed by a molding compound that forms a package for the chip. The molding compound has a capacitance associated with it. The integrated circuit chip includes a second integrated circuit element within the molding compound in which the second integrated circuit element monitors the molding compound to detect a change in capacitance in the molding compound resulting from a removal of a portion or all of the molding compound. In response to a detection of a change in capacitance, the second integrated circuit element alters the desired circuit function provided by the other integrated circuit elements.