Head suspension assembly with electrical interconnect by slider bond pads and gimbal bonding zones

摘要

A head gimbal assembly allows a simplified, automatable electrical interconnection from the read/write head slider to the head suspension assembly electrical interconnect. The head suspension assembly is constructed as a laminated structure. Using a read/write head slider with electrical bond pads on an upper horizontal surface (i.e, the head slider surface bonded to the head suspension assembly and opposite to the disk- confronting head slider surface), electrical interconnection to bonding zones on the upper horizontal surface of the gimbal region is established using standard automated or semi-automated wire bond tooling technology.