The method of sequential laser treatment for efficiently producing modules that require the removal of a large volume density material for forming the micro-vias

摘要

Toward the bottom surface of the substrate from the upper surface of the substrate in [Abstract] laminate substrate, using a trepanning operation of the first of the laser focused spot of the laser of the first laser and the first, (57) blind vias It is a method of forming the blind vias by laser drilling. Then, toward the bottom surface from the top surface, using a trepanning operation of the second laser with the focused spot of the laser and the second laser of the second, the vias are laser drilled.