首页> 外国专利> MANUFACTURE FOR THIN-FILM THERMOELECTRIC CONVERSION ELEMENT AND THE THIN-FILM THERMOELECTRIC CONVERSION ELEMENT

MANUFACTURE FOR THIN-FILM THERMOELECTRIC CONVERSION ELEMENT AND THE THIN-FILM THERMOELECTRIC CONVERSION ELEMENT

机译:薄膜热电转换元件的制造和薄膜热电转换元件的制造

摘要

PROBLEM TO BE SOLVED: To form a thermoelectric material thin film having a desirable composition ratios by a method, wherein when the thermoelectric material thin film that changes the conductivity type according to a change in composition ratios is formed on a substrate, substrate temperatures are controlled. ;SOLUTION: Through the use of a thermoelectric material that changes the conductivity type according to a change in the composition ratios, substrate temperatures are controlled, whereby the composition ratio of a thermoelectric material thin film is controlled, thereby forming a desired conductivity type of the thermoelectric material thin film. As a method for controlling the substrate temperatures, the next method is disclosed, namely, in a film former, a heater and cooling means are integrated into a desired pattern in a substrate holder for holding the substrate, or a Peltier element is integrated, disposed, or the like into a desirable pattern, and the temperature distribution is kept on the surface of a substrate holder, whereby the temperature distribution is kept on the substrate, too. Thus, a prescribed temperature distribution is kept on the substrate to form the thermoelectric material, thereby obtaining a p-type or n-type thermoelectric material thin film which maximizes a performance index.;COPYRIGHT: (C)2000,JPO
机译:解决的问题:为了通过一种方法形成具有期望的组成比的热电材料薄膜,其中当在基板上形成根据组成比的变化而改变导电类型的热电材料薄膜时,控制基板温度。 ;解决方案:通过使用根据组成比的变化而改变导电类型的热电材料,可以控制基板温度,从而控制热电材料薄膜的组成比,从而形成所需的导电类型。热电材料薄膜。作为用于控制基板温度的方法,公开了下一种方法,即在成膜器中,将加热器和冷却装置集成在用于保持基板的基板保持器中的期望图案中,或者集成,设置珀耳帖元件。或类似物形成期望的图案,并且温度分布保持在基板保持器的表面上,由此温度分布也保持在基板上。因此,将规定的温度分布保持在基板上以形成热电材料,从而获得使性能指标最大化的p型或n型热电材料薄膜。版权所有:(C)2000,JPO

著录项

  • 公开/公告号JP2000261052A

    专利类型

  • 公开/公告日2000-09-22

    原文格式PDF

  • 申请/专利权人 SHARP CORP;

    申请/专利号JP19990058644

  • 申请日1999-03-05

  • 分类号H01L35/34;C23C14/54;H01L35/16;

  • 国家 JP

  • 入库时间 2022-08-22 02:03:18

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