PRESS PART SUPERIOR IN SOLDABILITY WITH SUBSTRATE AND DEFORMATION PROCESSING MATERIAL FOR PRESS PART

摘要

PROBLEM TO BE SOLVED: To obtain a good soldability even if press processing is performed after plating by thinning the thickness of portions to be soldered to a substrate such as a terminal and a lead part against the material thickness of the other portion at a specified ratio.;SOLUTION: It is preferable that the thickness of a terminal and a lead part is made to be 1/3-3/4 of the material thickness at the other portion, and that the thickness of the terminal and the lead part is thinned by coining. A deformation processing material to be the terminal and the lead, whose position of the width direction is thinned in advance, is plated with tin or solder to form a press material. When the tip of the lead part to be soldered, namely a lead part (thin wall part) 32 is made thinner than a lead part (material thickness part) 33, the solder is easily adhered to the lead part (thin wall part) 32. When the solder is adhered to one portion of a top face of the lead part (thin wall part) 32, the lead part (material thickness part) 33 is also covered with the solder and soldered at a good quality since the wettability of the solder is good.;COPYRIGHT: (C)2000,JPO