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MANUFACTURING InP DISTRIBUTED FEEDBACK TYPE SEMICONDUCTOR LASER
MANUFACTURING InP DISTRIBUTED FEEDBACK TYPE SEMICONDUCTOR LASER
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机译:制造InP分布式反馈型半导体激光器
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摘要
PROBLEM TO BE SOLVED: To store the shape of a diffraction grating on the base surface contg. a specified substance in a good state by raising the base temp. up to the forming temp. of a thermal deformation-proof layer, and supplying specified substances, i.e., the material of this layer at once on the diffraction grating surface. ;SOLUTION: An n-InP substrate 10 is heated by the resistance heating method while a wafer carrier rotates at a fixed speed to rotate the substrate 10 on the wafer carrier at the same fixed time, and a raw material of a thermal deformation-proof layer, i.e., (C2H5)3Ga and AsH3 are uniformly distributed on the surface BS of the substrate 10 to substantially uniformize the thickness of the thermal deformation-proof layer on the surface BS. Then H2 is fed in a growing chamber R, the substrate 10 is heated up to 350°C in the forming temp. range of the thermal deformation proof layer 20 and stabilized at the temp. 350°C.;COPYRIGHT: (C)2000,JPO
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机译:要解决的问题:将衍射光栅的形状存储在底面上。通过提高基本温度使指定物质处于良好状态。直到成形温度防热变形层,并在衍射光栅表面上立即提供特定物质,即该层的材料。 ;解决方案:在晶片载体以固定速度旋转的同时,通过电阻加热法对n-InP基板10进行加热,以同时在晶片载体上旋转基板10上的基板10,并且该原料具有耐热变形性在基板10的表面BS上均匀地分布一层(C 2 H 5)3 Ga和AsH 3,以使表面BS上的抗热变形层的厚度基本均匀。然后,将H 2进料到生长室R中,在形成温度下将基板10加热到350℃。变形热防止层20的温度范围处于一定范围,并在该温度下稳定。 350°C;版权:(C)2000,JPO
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