CUTTING METHOD FOR HARD AND FRAGILE MATERIAL AND INNER PERIPHERAL BLADE CUTTING DEVICE

摘要

PROBLEM TO BE SOLVED: To manufacture silicon wafers without a sprue and warps provided with uniform thickness with high efficiency for a single crystal ingot cutting method and a device thereof using an inner peripheral blade. ;SOLUTION: In a cutting method for a hard and fragile material for feeding the head and fragile material 8 from the central side to the outer peripheral side of an inner peripheral blade 4 rotated at high speed, the vibration in the direction in which the hard and fragile material 8 moves close to and away from an abrasive grain layer 11 of the inner peripheral blade 4 is applied. The applied vibration is the circular vibration in the direction same as the rotating direction of the inner peripheral blade 4. The vibration is applied by interposing a vibrator between a feeder feeding a work holder to the radius direction of the inner peripheral blade 4 and the work holder. Cutting resistance can be reduced by the application of vibration, and undulations and bows on a cutting face can also be reduced. Also cuttings are discharged together with a fluid at the time of separation to increase the cutting efficiency. The type of vibration is the circular vibration which is applied to prevent the formation of a dimple or center mark on the center of the cutting face.;COPYRIGHT: (C)2000,JPO