首页> 外国专利> PARTS JOINTED BY BRAZING, SUBSTRATE TO WHICH PARTS ARE JOINTED BY BRAZING, MOUNTED SUBSTRATE AND MOUNTING METHOD FOR PARTS

PARTS JOINTED BY BRAZING, SUBSTRATE TO WHICH PARTS ARE JOINTED BY BRAZING, MOUNTED SUBSTRATE AND MOUNTING METHOD FOR PARTS

机译:通过钎焊连接的零件,要替代的零件通过钎焊,安装的底物和零件的安装方法连接的零件

摘要

PROBLEM TO BE SOLVED: To supply the sufficient amount of solder, to improve jointing strength and to easily and precisely position a mounted part by installing projecting or recessed parts fitted to the recessed or projecting parts of a substrate to be jointed. ;SOLUTION: When a part terminal 3 on a mounted part 2 is arranged on a mounted board 1 through solder paste 7 applied on a land pattern on the mounted board 1, projecting and recessed parts 4 on the part terminal 3 and projecting/recessed parts 5 on the land pattern 6 corresponding to the parts are combined and are temporarily fixed at the time of positioning by a parts mounting machine. When the part terminal 3 is physically and electrically fixed on the land pattern in a reflow process, the amount of solder paste applied to the terminal where the projecting/recessed parts are made is increased by the increased amount of an effective soldering area. Thus, soldering junction strength improves and soldering reliability improves.;COPYRIGHT: (C)2000,JPO
机译:要解决的问题:要提供足够数量的焊料,以提高接合强度,并通过将凸出或凹入的零件安装到要接合的基板的凹入或凸出的零件上来轻松而精确地定位已安装的零件。 ;解决方案:当通过在安装板1上的焊盘图形上施加的焊锡膏7将安装部件2上的部件端子3布置在安装板1上时,部件端子3上的凹凸部件4和凹凸部件如图5所示,在与零件对应的焊盘图案6上进行组合,并在通过零件安装机定位时临时固定。当在回流工艺中将零件端子3物理地和电气地固定在焊盘图案上时,通过增加有效焊接面积的量,增加了施加到制造突出/凹陷部分的端子上的焊膏的量。因此,提高了焊接结点的强度,提高了焊接可靠性。;版权所有:(C)2000,JPO

著录项

  • 公开/公告号JP2000133919A

    专利类型

  • 公开/公告日2000-05-12

    原文格式PDF

  • 申请/专利权人 SONY CORP;

    申请/专利号JP19980301346

  • 发明设计人 KODAIRA SHINICHI;

    申请日1998-10-22

  • 分类号H05K3/34;B23K1/00;B23K33/00;

  • 国家 JP

  • 入库时间 2022-08-22 02:02:33

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