DEVICE FOR ELECTROPLATING WIRE, METHOD FOR ELECTROPLATING WIRE, AND PRODUCTION OF ELECTROPLATED WIRE

摘要

PROBLEM TO BE SOLVED: To provide an electroplating device by which a flawless high-quality plating layer can be formed on the surface of a wire, the maintenance work and its cost and the equipment cost can be also reduced, and the formation of the plating layer can be positively controlled. ;SOLUTION: A group of plural diskas 2 on which a wire 4 is wound, demarcating plural moving paths and freely mutually rotatable and plural feeder rollers 9 for power feeding the wire on every one or ≥2 moving paths while plating the wire in the process of moving the wire on its path.;COPYRIGHT: (C)2000,JPO