METHOD FOR IMAGE-PICKING UP MACHINED MATERIAL BY THREE-DIMENSIONAL LASER BEAM MACHINING DEVICE AND THREE-DIMENSIONAL LASER BEAM MACHINING DEVICE USING THE METHOD

摘要

PROBLEM TO BE SOLVED: To provide a machined material image pickup method by three-dimensional laser beam machining device, which can stably detect a picture even if the direction of illumination changes or material quality of a high reflectance is used, and to provide a three-dimensional laser beam machining device using the method. SOLUTION: In the three-dimensional laser beam machining device provided with a three-dimensional laser beam machining head 1 having a CCD camera 5, an illumination means 15 illuminating an image-picked up part 7 and with a picture processor, a light source 19 which can freely move on a circular orbit is installed in the illumination means 15. The light source 19 is moved to a plurality of positions on a circular orbit, the image-picked up part 7 is image-picked up by the CCD camera 5 in a plurality of light source positions, a plurality of pictures obtained by eliminating a picture area of more than a prescribed lightness are generated from a plurality of image pickup pictures, a plurality of generated pictures are overlapped and the whole pictures are composited.