首页> 外国专利> POLYVINYLACETAL RESIN FOR HEAT-DEVELOPABLE PHOTOSENSITIVE MATERIAL, MODIFIED POLYVINYLACETAL RESIN FOR HEAT-DEVELOPABLE PHOTOSENSITIVE MATERIAL AND HEAT- DEVELOPABLE PHOTOSENSITIVE MATERIAL

POLYVINYLACETAL RESIN FOR HEAT-DEVELOPABLE PHOTOSENSITIVE MATERIAL, MODIFIED POLYVINYLACETAL RESIN FOR HEAT-DEVELOPABLE PHOTOSENSITIVE MATERIAL AND HEAT- DEVELOPABLE PHOTOSENSITIVE MATERIAL

机译:用于热致变光材料的聚乙烯树脂,用于热致变光材料的改性聚乙烯树脂和热致光敏材料

摘要

PROBLEM TO BE SOLVED: To improve the pot life of a soln. before application and the storage property and fog of a raw film and to improve sharpness of an image and gradation. ;SOLUTION: A polyvinylacetal resin or a modified polyvinyl acetal resin having modified groups comprising hydrophilic groups such as carboxyl groups in the side chains is used. The polymn. degree of the resin is 200 to 3000, the proportion of residual acetyl groups is 0 to 2 mol%, and the proportion of residual hydroxy group is 17 to 35 mol%. The resin does not contain an antioxidant and has ≤100 ppm content of residual halides. Especially preferably, the resin has ≤0.01 wt.% residual alkaline material content.;COPYRIGHT: (C)2000,JPO
机译:要解决的问题:延长焊锡的适用期。涂布前和原始膜的储存性能和雾化方面,以改善图像的清晰度和层次。 ;解决方案:使用具有在侧链中包含亲水性基团例如羧基的改性基团的聚乙烯醇缩醛树脂或改性聚乙烯醇缩醛树脂。该polymn。树脂的饱和度为200至3000,残余乙酰基的比例为0至2mol%,残余羟基的比例为17至35mol%。该树脂不含抗氧化剂,残留卤化物含量≤100 ppm。特别优选地,该树脂具有≤0.01重量%的残余碱性物质含量。;版权:(C)2000,JPO

著录项

  • 公开/公告号JP2000235243A

    专利类型

  • 公开/公告日2000-08-29

    原文格式PDF

  • 申请/专利权人 SEKISUI CHEM CO LTD;

    申请/专利号JP19990138730

  • 发明设计人 KORI TOMOYUKI;

    申请日1999-05-19

  • 分类号G03C1/498;C08F8/28;C08F16/38;

  • 国家 JP

  • 入库时间 2022-08-22 02:00:33

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