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DIGITAL HIGH FREQUENCY ANALOG HYBRID IC CHIP, IC PACKAGE AND DIGITAL HIGH FREQUENCY ANALOG HYBRID IC
DIGITAL HIGH FREQUENCY ANALOG HYBRID IC CHIP, IC PACKAGE AND DIGITAL HIGH FREQUENCY ANALOG HYBRID IC
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机译:数字高频模拟混合IC芯片,IC封装和数字高频模拟混合IC
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摘要
PROBLEM TO BE SOLVED: To reduce the size by grounding at least one I/O pad of a digital circuit provided between the I/O pads of high frequency signal I/O terminals adjacent to digital I/O terminals through a capacitor which can be considered to be short-circuited at high frequency and to be opened for a digital signal. ;SOLUTION: As a pin for isolating I/O pins 1a at a high frequency analog section, an I/O pin 1c for digital signal is provided at a position where a pin having only ground function is normally provided. It is grounded, on the outside of a package, through a capacitor 7 which can be considered as a sufficiently low impedance at a high frequency used in a high frequency analog and as a sufficiently high impedance at the frequency of a digital signal handled in a digital circuit. Consequently, a function for isolating the I/O pins 1a at the high frequency analog section can be provided without causing a damage on the function of the digital I/O pin 1c as the I/O pin of a digital circuit.;COPYRIGHT: (C)2000,JPO
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