ELECTROCONDUCTIVE ADHESIVE, MOUNTED STRUCTURAL FORM, LIQUID CRYSTAL DEVICE, ELECTRONIC EQUIPMENT, AND PRODUCTION OF MOUNTED STRUCTURAL FORM, LIQUID CRYSTAL DEVICE AND ELECTRONIC EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To obtain an electroconductive adhesive standing soldering reflow treatment in mounting e.g. a substrate with electronic parts. SOLUTION: This electroconductive adhesive 7 is obtained by mixing electroconductive particles 16 into an adhesive resin 14; wherein each of the electroconductive particles 16 is made up of a synthetic resin core material 17 and an electroconductive material 18 coating the core material 17; the core material 17 is such a material as to be higher in heat distortion temperature than the adhesive resin 14, being pref. =120 deg.C in heat distortion temperature (under a load of 18.6 kg/cm2) determined in accordance with the test specified in ASTM D648, more pref. one of the following materials: polyphenylene oxide, polysulfone, polycarbonate, polyacetal and polyethylene terephthalate.