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Process for mounting on circuit grinding material is brittle and mill for that.
Process for mounting on circuit grinding material is brittle and mill for that.
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机译:用于安装在电路研磨材料上的过程非常脆弱,为此需要磨碎。
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摘要
Invention patent: b "process for grinding circuit of grinding material is brittle and mill for that" d .For grinding material grinding brittle ore, especially wet and / or other minerals wet, with employment of a press of high pressure cylinders of fragmentation of the bed of material.On the surfaces of the cylinders are protected against wear by means of a shielding screen through a protective layer against wear autogenic.With the demand of specific energy as low as possible.Without having to bear the risk of damage of the protective layer against premature wear with the occurrence of coarse / super grain / grain injected, it is proposed according to the invention,Pre - connect to the press of high pressure cylinders of fragmentation of the bed of material (10), a windmill of smooth rollers (26), in which the gap of cylinders.It is limited in its slit width to approximately a maximum of 4 mm, only the super grain (grain injected) contained in the material of alimentau00e7u00e0o is pre fragmented by the fragmentation of individual grains.
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