首页> 外国专利> PRODUCTION PROCESS OF LOW TEMPERATURE COFIRED CERAMIC ON METAL(LTCC-M) BASE PLATE WITH FLAT SURFACE

PRODUCTION PROCESS OF LOW TEMPERATURE COFIRED CERAMIC ON METAL(LTCC-M) BASE PLATE WITH FLAT SURFACE

机译:带有平整表面的金属(LTCC-M)基板上的低温烧结陶瓷的生产工艺

摘要

PURPOSE: A production process of a LTCC-M base plate is provided wherein a low temperature fired ceramic is attached to the both side of a metal base to minimize a camber and controls the change of a camber in the post-firing process so that a flip-chip is easily combined with the LTCC-M base plate. CONSTITUTION: A production process is as follows: (1) a first step which prepares the metal and multiple LTCC green tapes independently; (2) a second which prepares a first and a second green tape piled body on the basis of the LTCC green tapes in (1); (3) a third which attaches the first and the second green tape piled body to the upper and lower part of the metal base respectively and presses to form the pressed body; (4) a fourth which cofires the pressed body to form a small cofired LTCC-M body; (5) a fifth which polishes both ceramic surfaces of the cofired LTCC-M base plate; and (6) a sixth which forms a circuit pattern on the polished ceramic surface to complete the base plate.
机译:目的:提供一种LTCC-M基板的生产工艺,其中将低温烧制的陶瓷附着到金属基座的两侧,以最大程度地减少弧度,并在后烧制过程中控制弧度的变化,倒装芯片很容易与LTCC-M基板结合使用。组成:一种生产过程如下:(1)第一步,分别准备金属和多个LTCC环保胶带; (2)第二种,其根据(1)中的LTCC生带准备第一和第二生带堆叠体; (3)第三种,其将第一和第二生坯带堆叠体分别附着到金属基体的上部和下部,并压制以形成压制体; (4)第四部分,将被压制的主体共同点火,以形成一个小型的共同点火的LTCC-M主体; (5)第五个,对共烧的LTCC-M基板的两个陶瓷表面进行抛光; (6)第六部分,其在抛光的陶瓷表面上形成电路图案以完成基板。

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