HIGHLY HEAT-RESISTANT POLYAMIDEIMIDE RESIN CONTAINING CYCLOHEXYLIDENE-BASED ALIPHATIC RING AND PREPARATION THEROF

摘要

PURPOSE: A soluble polyamideimide resin which conserves properties of the conventional polyamideimide resin and has good solubility, formability and processing property as well as has excellent heat-resistance to be used as an essential heat-resistant material in various electric, electronic and aviation industries is provided. CONSTITUTION: A polyamideimide resin according to the present invention comprises a repeating unit of the formula (1): £formula 1| wherein R' is one or more groups selected from the group consisting of the following and formula (I) to (VII) provided that the resin necessarily comprises a functional group selected from the group consisting of the formula (I) to (VII). The polyamideimide resin according to the present invention is prepared by reacting trimellitic chloride with one or more aromatic diamines of the formula 2: £formula 2| wherein R is hydrogen, 4-methyl, 4-ethyl, 4-t-butyl, 4-amyl, 4-phenyl or 3,3,5-trimethyl, R' is one or more groups selected from the group consisting of the following and formula (I) to (VII) provided that the resin necessarily comprises a functional group selected from the group consisting of the formula (I) to (VII).