FABRICATION METHOD OF LEAD FRAME USING PILOTING METHOD

摘要

The present invention relates to a method of manufacturing a lead frame by etching, and aims at overcoming a decrease in lead frame yield due to misalignment of a silver plated region of the lead frame base material and an exposure mask.;Such an object of the present invention includes the steps of (a) forming a plurality of pinholes at both ends of the substrate to be fed and supplied; (b) detecting and pin piloting the pinhole of the base material; (c) silver plating at least one surface of the base material; (d) depositing a photoresist on at least one surface of the base material; (e) detecting and pin piloting the pinhole of the base material; (f) exposing at least one surface of the base material; is achieved by a method of manufacturing a lead frame using a pilot (pilotig) method, characterized in that it comprises a.