Carrier arrangement to accommodate semiconducting element has carrying frame to which heat conducting body is attached using at least one welded joint, e.g. laser welded joint

摘要

The carrier arrangement has at least one heat conducting body (3) for accommodating at least one semiconducting element and a carrying frame (2) to which the heat conducting body is attached using at least one welded joint. The welded joint can be a laser welded joint. Each surface onto which the welding laser beam is to be incident is designed so that the beam is incident on the surface of the carrier arrangement at least on further time. AN Independent claim is also included for a method of making an attachment connection between a heat conducting body accommodating at least one semiconducting element and a carrying frame.