A method and device for the coating of substrates by means of bipolar pulse - magnetron - atomization

摘要

The invention relates to a method and device for coating substrates by means of bipolar pulse magnetron sputtering using three or more targets. The substrates are placed opposite the targets essentially in the range of a high plasma density, whereby at least two targets are connected to a potential-free bipolar power supply device and are sputtered for a predetermined period of time. The selection of the target respectively connected to the bipolar power supply device is altered during the course of the coating process according to a technologically predetermined program. The device is comprised of at least three magnetron sources (17, 17', 17'') provided with targets (18, 18', 18''), of a potential-free bipolar power supply device (21), and of a switching device (20) for switching the current electrical connection of selected targets with the bipolar power supply device (21) according to a technologically predetermined program.