Pressure-sensitive and structural adhesive for the aggressive fixing of parts to be joined, followed by curing in the adhesive joint using thermal energy

摘要

A pressure sensitive and structural adhesive for aggressive fixing via an adhesive joint to be joined with subsequent parts, followed by curing by accompanying cohesion build-up in the adhesive joint by means of thermal energy supply, containing a mixture of copoly (meth) acrylates and epoxy resins, is characterized in that the mixture as an activatable component for thermal curing and in the function of an adhesive resin contains a copolymer.