Protecting surfaces of semiconductor chips in chip cards involves sealing active surface and contact zones by cast resin, and then covering them with light-shading lacquer layer

摘要

The active surface region (8) and the contact zones of the chip (5) are first sealed by means of a cast resin (9), and are then covered with a lacquer layer (10) producing a strong light shading effect. An Independent claim is also included for a chip card with at least one semiconductor chip protected by the proposed method.