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Thin-walled and profiled three-dimensional body for door panels etc is prepared from mixture of wood and/or wood particles with bonding agent molded by heat and pressure
Thin-walled and profiled three-dimensional body for door panels etc is prepared from mixture of wood and/or wood particles with bonding agent molded by heat and pressure
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机译:用于门板等的薄壁型材三维物体是由木材和/或木材颗粒与通过加热和加压成型的粘合剂的混合物制成的
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摘要
The thin-walled and three-dimensional shaped body consists of a mixture of wood and/or wood particles and heat-setting powder bonding agent at a rate of 10-15% of the material. The mean particle size of the wood or wood particles is 0.1-0.6 mm. The mixture is shaped by heat and pressure. At least one surface of the shaped body is cladded with a thin-walled plastic film or a biodegradable varnish. The wood or wood particles have a generally spherical shape, with a mean particle size of preferably 0.1-0.3 mm. The wood or wood particles are taken from wood chips or unsoiled or ecologically treated chip particles, reduced by a ring blade cutter. The preferably ratio of bonding agent is 12-14% of the mixture. The shaping is through a one-piece or multi-part die, at a pressure of 20-45 bar and a hardening temp. of 140-180 deg C. The die forming can be in a stage press, or a single press with a number of rotating and heated dies. The surface of the shaped body is cladded with a plastics film with a thickness of 0.1-0.5 mm. The film is embossed and/or given a wood grain effect. The film is applied by a vacuum press. The surface can be coated with a biodegradable varnish. The bonding agent powder has a particle size of 10 mu m to 0.6 mm. Air channels (9) are fitted between the covering and intermediate layers and/or between adjacent intermediate layers. Two panels can be bonded together with perforated paper webs. An Independent claim is included for a production process where the panel with the intermediate layer are pressed together in an unheated press at the bonding station. The bonding station has a drilling to develop an under pressure between the covering panel (1), the bonding unit (5) and the intermediate layer (s) (8).
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