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polyimid laminate comprehensively a thermoplastic polyimidpolymer or a thermoplastic polyimidfilm and processes for the manufacture of the laminate
polyimid laminate comprehensively a thermoplastic polyimidpolymer or a thermoplastic polyimidfilm and processes for the manufacture of the laminate
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机译:聚酰亚胺层压板全面地包括热塑性聚酰亚胺聚合物或热塑性聚酰亚胺膜及其制造方法
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摘要
A thermoplastic polyimide polymer suitable for use in making a flexible printed wiring board as a cover lay adhesive excellent in thermal resistance, processability and adhesiveness, a cover lay film, an adhesive layer for a double-sided adhesive sheet or FCCL, etc. The polymer is represented by general formula (1), wherein Ar1, Ar2, Ar4 and Ar6 represent each a bivalent organic group; Ar3 and Ar5 represent each a tetravalent organic group; l, m and n represent each 0 or a positive integer of 1 or above, provided the sum of 1 and m equals 1 or above; and t represent a positive integer of 1 or above. A thermoplastic polyimide film produced from this polymer has a well-defined glass transition point in a temperature range of 100 to 250 DEG C and a low-temperature adhesiveness. A polyimide laminate is produced by stacking a layer of the thermoplastic polyimide polymer on one or both sides of a non-thermoplastic polyimide film. A flexible copper-clad laminated board having an excellent peel strength is produced by superimposing a copper foil on the thermoplastic polyimide polymer layer and laminating the assembly near the glass transition point. CHEM
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