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Achievement of top rounding in shallow trench etch

机译:在浅沟槽刻蚀中实现顶部修圆

摘要

A process for forming a shallow trench having steep sidewalls near its bottom and sloping sidewalls at the top is described. The process is in 3 stages. The first stage involves methane trifluoride, carbon tetrafluoride, argon, and oxygen. The second stage involves methane trifluoride and methane monofluoride, while the third stage involves hydrogen bromide, chlorine, and helium/oxygen. If the ratio of the various components at each stage is carefully controlled along with other variables such as discharge power, pressure, and duration, the trench profile described above is obtained with a minimum of deposited polymer material on the sidewalls.
机译:描述了一种用于形成浅沟槽的工艺,该浅沟槽在其底部附近具有陡峭的侧壁并且在顶部具有倾斜的侧壁。该过程分为三个阶段。第一阶段涉及三氟化甲烷,四氟化碳,氩气和氧气。第二阶段涉及三氟化甲烷和一氟化甲烷,而第三阶段涉及溴化氢,氯和氦/氧。如果在每个阶段与各种变量(如放电功率,压力和持续时间)一起仔细地控制各种组分的比例,则可以获得上述沟槽轮廓,并且在侧壁上沉积的聚合物材料最少。

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