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Apparatus for coating resist and developing the coated resist

机译:用于涂覆抗蚀剂并显影涂覆的抗蚀剂的设备

摘要

Disclosed is a resist coating-developing method and apparatus including (a) a setting step for setting a target value and an allowable range thereof, (b) a resist-coating step, (c) a pre-baking step, (d) a first cooling step, (e) a light-exposure step, (f) a line width measuring step for measuring a line width of a latent image, (g) a post- baking step, (h) a second cooling step, (i) a developing step, (j) a judging step determining whether or not the value of the line width of the latent image measured in the step (f) falls within the allowable range of the target value set in the step (a), (k) a calculating step for calculating a difference between the measured value of the latent image line width and the target value, and (l) a correcting step for correcting the process condition in at least one previous step.
机译:公开了一种抗蚀剂涂层显影方法和设备,包括:(a)用于设定目标值及其允许范围的设置步骤;(b)抗蚀剂涂层步骤;(c)预烘烤步骤;(d)a。第一冷却步骤,(e)曝光步骤,(f)用于测量潜像线宽的线宽测量步骤,(g)烘烤后步骤,(h)第二冷却步骤,(i )显影步骤;(j)判断步骤,确定步骤(f)中测量的潜像的线宽值是否落在步骤(a)中设定的目标值的允许范围内, k)计算步骤,用于计算潜像线宽度的测量值与目标值之间的差,以及(l)校正步骤,用于校正至少一个先前步骤中的处理条件。

著录项

  • 公开/公告号US6051349A

    专利类型

  • 公开/公告日2000-04-18

    原文格式PDF

  • 申请/专利权人 TOKYO ELECTRON LIMITED;

    申请/专利号US19990386459

  • 发明设计人 KUNIE OGATA;KAZUTOSHI YOSHIOKA;

    申请日1999-08-31

  • 分类号G03F9/00;B05C11/02;B05C13/00;

  • 国家 US

  • 入库时间 2022-08-22 01:37:23

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