首页> 外国专利> Protection of hydrogen sensitive regions in semiconductor devices from the positive charge associated with plasma deposited barriers or layers

Protection of hydrogen sensitive regions in semiconductor devices from the positive charge associated with plasma deposited barriers or layers

机译:保护半导体器件中的氢敏感区免受与等离子体沉积的势垒或层相关的正电荷

摘要

A semiconductor device with first and second types of devices formed in a semiconductor substrate with a barrier layer formed over the surface of the semiconductor device including over the first and second types of devices with the barrier layer removed from over the first type of device. The first type of device is a positive charge sensitive device such as a nonvolatile memory device. The semiconductor device has a hydrogen getter layer formed under the barrier layer.
机译:一种半导体器件,其具有形成在半导体衬底中的第一和第二类型的器件,并且在半导体器件的表面上方形成有阻挡层,该阻挡层包括在第一和第二类型的器件之上,并且阻挡层从第一类型的器件之上去除。第一类设备是正电荷敏感设备,例如非易失性存储设备。半导体器件具有在阻挡层下方形成的氢吸气剂层。

著录项

  • 公开/公告号US6060766A

    专利类型

  • 公开/公告日2000-05-09

    原文格式PDF

  • 申请/专利权人 ADVANCED MICRO DEVICES INC.;

    申请/专利号US19970918244

  • 发明设计人 SUNIL D. MEHTA;WILLIAM G. EN;

    申请日1997-08-25

  • 分类号H01L29/06;

  • 国家 US

  • 入库时间 2022-08-22 01:37:11

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