首页> 外国专利> Methods of forming conductive lines, methods of forming antennas, methods of forming wireless communication devices, conductive lines, antennas, and wireless communications devices

Methods of forming conductive lines, methods of forming antennas, methods of forming wireless communication devices, conductive lines, antennas, and wireless communications devices

机译:形成导线的方法,形成天线的方法,形成无线通信设备的方法,导线,天线和无线通信设备

摘要

Methods of forming conductive lines, antennas, and wireless communications devices, and related conductive lines, antennas and wireless communications devices are described. In one aspect, a substrate having an outer surface is provided. A first layer of conductive material is formed over the outer surface. A second layer of conductive material is formed over only portions of the first layer. Using the second layer as a masking layer, the first layer is etched selectively relative thereto to provide a conductive line comprising the first and second layers. Preferably, the first layer is more conductive than the second layer. In a preferred implementation, the conductive line constitutes an antenna construction which is suitable for use in a wireless communications device. In another preferred implementation, an antenna, an integrated circuitry chip, and a battery are mounted on a substrate and operably interconnected to provide an integrated circuitry chip, with the antenna being formed as described above.
机译:描述了形成导线,天线和无线通信设备的方法,以及相关的导线,天线和无线通信设备。一方面,提供了一种具有外表面的基板。在外表面上形成第一导电材料层。仅在第一层的一部分上形成第二导电材料层。使用第二层作为掩模层,相对于第一层选择性地蚀刻第一层,以提供包括第一层和第二层的导线。优选地,第一层比第二层更导电。在优选的实施方式中,导线构成天线结构,该天线结构适用于无线通信设备。在另一优选实施方式中,天线,集成电路芯片和电池被安装在基板上并且可操作地互连以提供集成电路芯片,其中天线如上所述形成。

著录项

  • 公开/公告号US6067056A

    专利类型

  • 公开/公告日2000-05-23

    原文格式PDF

  • 申请/专利权人 MICRON TECHNOLOGY INC.;

    申请/专利号US19990255847

  • 发明设计人 RICKIE C. LAKE;

    申请日1999-02-23

  • 分类号H01Q1/38;

  • 国家 US

  • 入库时间 2022-08-22 01:37:04

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