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Letter for funeral attendance gratitude

机译:葬礼感谢信

摘要

(57) Abstract (Modified) Topic The case of funeral, postcard (postcard) at size of condition ohThe te, making use of the letter for funeral attendance gratitude, information of the deceased and the chief mourner etcThe letter for funeral attendance gratitude which can be able via visual sense is offeredru. Solutions In the letter 1 for funeral attendance gratitude, face copying of the deceasedTruth 2, or mug shot of the deceased and mug shot 3 of chief mourner, orMug shot of the deceased and mug shot of chief mourner and mug shot 4 of family of chief mournerWith contents 5, the funeral attendance gratitude which features that it publishesTo be the business letter, in the letter for funeral attendance gratitude which two-fold is done,It Perforating in the space of one side facilities to do the hole, being the other space, the aforementioned holeApplication/response this to lay out the mug shot of the deceased in the place where it does, in the other partsThe letter for funeral attendance gratitude which features that contents are laid out.
机译:(57)<摘要>(经修改)<主题>丧葬的情况,条件大小的明信片(明信片)哦,利用葬礼感谢信,死者和丧葬人员的信息等,丧葬信提供可以通过视觉感知的出席感激。解决方案在为丧葬人员表示感谢的信件1中,对死者的真相2进行脸部复制,或者对死者的杯子射击和首席送葬者的杯子射击3,或者对死者的杯子射击和首席送葬者的杯子射击,对酋长家庭的杯子射击4送葬者以内容5,其所发布的letter葬感谢信为商务信函,在完成的双重fun葬感谢信中,在一侧设施的空间打孔,作为另一空间,前述的孔申请/回应在其他地方布置死者的面部照片,在其他部分以内容安排为特征的fun葬感谢信。

著录项

  • 公开/公告号JP3075932U

    专利类型

  • 公开/公告日2001-03-16

    原文格式PDF

  • 申请/专利权人 元屋 芳樹;

    申请/专利号JP20000006220U

  • 发明设计人 元屋 芳樹;

    申请日2000-08-29

  • 分类号B42D15/02;

  • 国家 JP

  • 入库时间 2022-08-22 01:35:39

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