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The copper basic alloy which designates precipitation hardening and solid solution hardening as merit

机译:以沉淀硬化和固溶硬化为优的铜基合金

摘要

A phosphor bronze alloy consisting of: 0.4 to 3.0 wt.% Ni, 1.0 to 11.0 wt.% Sn, 0.1 to 1.0 wt.% Si, 0.01 to 0.35 wt.% P, the remainder being substantially Cu. The alloy is suitable for electrical lead conductors and for electrical or electronic interconnections.
机译:磷青铜合金,其包含:0.4至3.0重量%的Ni,1.0至11.0重量%的Sn,0.1至1.0重量%的Si,0.01至0.35重量%的P,其余基本上为Cu。该合金适用于导线导体以及电气或电子互连。

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