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Abatement methods and abatement systems for the semiconductor manufacturing exhaust gas

机译:半导体制造废气的减排方法和减排系统

摘要

PROBLEM TO BE SOLVED: To provide a equipment for eliminating damage for off-gas which can correspond to a multi-chamber type CVD with a single equipment, and has simple structure and small installation area, and provide a method for damage eliminating the off-gas which is able to eliminate damages safely, even if the installation area of the equipment is small. ;SOLUTION: This equipment for eliminating damage is provided with a plurality of independent damage eliminating equipment units which are connected with respective chambers 1 of a CVD 2, having a plurality of the chambers 1 by the use of an independent piping 4, and an exit scrubber 10 for collecting the gas treated with the damage eliminating equipment units and cleaning and cooling the gas together. The damage eliminating equipment units are provided with entrance scrubbers 5 and reaction cylinders as heating oxidizing decomposing zones 7.;COPYRIGHT: (C)1999,JPO
机译:要解决的问题:提供一种消除废气损害的设备,该设备可以用单个设备对应于多室型CVD,并且结构简单,安装面积小,并且提供一种消除废气的损害的方法。即使设备的安装面积很小,也能安全消除损坏的气体。 ;解决方案:该消除损害的设备配备有多个独立的消除损害设备单元,这些单元与CVD 2的各个腔室1相连接,并通过使用独立的管道4来具有多个腔室1,并具有一个出口洗涤器10,用于收集用消除损伤设备单元处理过的气体,并一起清洁和冷却该气体。损害消除设备单元装有入口洗涤塔5和反应筒,作为加热氧化分解区7;版权所有:(C)1999,JPO

著录项

  • 公开/公告号JP3215081B2

    专利类型

  • 公开/公告日2001-10-02

    原文格式PDF

  • 申请/专利权人 カンケンテクノ株式会社;

    申请/专利号JP19970348632

  • 发明设计人 今村 啓志;

    申请日1997-12-02

  • 分类号H01L21/205;B01D53/34;C23C16/44;

  • 国家 JP

  • 入库时间 2022-08-22 01:35:06

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