Pressure welding die semiconductor equipment and its production manner and thermal compensator

摘要

A semiconductor substrate (2) is pressed against HEAT compensators (6 and 31) for electrical contact therewith without brazing. Silicone rubber (32) fixes the outer peripheral edge of the semiconductor substrate (2) and its adjacent portion ON the HEAT compensator (31), preventing position shifts of the semiconductor substrate (2) without thermal distortion and, accordingly and preventing damages to the semiconductor substrate (2). The absence of thermal distortion, spikes and voids due to brazing permits the prevention of electrical characteristic deterioration.