Burn-in test jig for semiconductor device and burn-in test method

摘要

PROBLEM TO BE SOLVED: To provide a jig and method for performing burn-in test on semiconductor device by which the deformation of solder balls can be suppressed when burn-in tests are performed on a semiconductor device, even when eutectic solder is used for securing the mountability of the semiconductor device. SOLUTION: A jig for performing burn-in test on semiconductor device comprises a substrate 2 which is interposed between a semiconductor device 7 and an anisotropic conductive sheet 4, and contact sections 3 which are integrally formed with the substrate 2 through the substrate 2 and are made of a conductive material and into which ball grids 8 are inserted. The jig is constituted in such a way that the ball grids 8 are pressed against the electrode sections 5 of the conductive sheet 4 through the contact sections 3.