首页> 外国专利> MANUFACTURING METHOD OF COMPLEX SUBSTRATE, COMPLEX SUBSTRATE, AND THIN FILM LIGHT EMISSION ELEMENT USING THE SAME

MANUFACTURING METHOD OF COMPLEX SUBSTRATE, COMPLEX SUBSTRATE, AND THIN FILM LIGHT EMISSION ELEMENT USING THE SAME

机译:使用相同的复合基板,复合基板和薄膜发光元件的制造方法

摘要

PROBLEM TO BE SOLVED: To obtain an easy manufacturing method of a complex substrate by which high display quality is obtained without polishing when it apples to a thin film light emission element, the complex substrate, and the thin film EL element, by an influence of an electrode layer which does not produce unevenness on the insulated layer surface.;SOLUTION: In the manufacturing method of the complex substrate, at first a complex-substrate precursor is obtained by carrying out thick-film layer formation of an electrode paste and an insulator paste one to form a laminating formation of an electrode green and an insulator green on the substrate which has electric insulation characteristic. Next, the pressurization processing of the substrate is carried out to make the precursor surface flat and smooth, and after that, calcinations is carried out to this to obtain the complex substrate. Moreover, the EL element using the complex substrate and the complex substrate is included.;COPYRIGHT: (C)2001,JPO
机译:解决的问题:为了获得一种容易制造的复合基板的方法,通过该复合基板的影响,在薄膜发光元件,复合基板和薄膜EL元件上形成苹果时,无需抛光即可获得高显示质量。解决方案:在复合基板的制造方法中,首先,通过形成电极糊和绝缘体的厚膜层来获得复合基板前体在具有电绝缘特性的基板上粘贴一层以形成电极生坯和绝缘体生坯的层压结构。接下来,进行基板的加压处理以使前体表面平坦且光滑,然后对其进行煅烧以获得复合基板。另外,还包括使用复合基板和复合基板的EL元件。版权所有:(C)2001,日本特许厅

著录项

  • 公开/公告号JP2001250677A

    专利类型

  • 公开/公告日2001-09-14

    原文格式PDF

  • 申请/专利权人 TDK CORP;

    申请/专利号JP20000059522

  • 申请日2000-03-03

  • 分类号H05B33/02;B28B11/10;C04B41/81;C04B41/87;C04B41/89;G09F9/00;G09F9/30;H05B33/10;H05B33/22;

  • 国家 JP

  • 入库时间 2022-08-22 01:33:51

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