The photo-curing die silicone resin constituent for the implemental circuit board protective coating of the non composition, and conservation manner null of the implemental circuit board which uses

摘要

PURPOSE: To obtain the subject composition capable of forming a uniform coating film without diluting it with a solvent such as an organic solvent, curable in a short time, having a viscosity in a specific range. ;CONSTITUTION: This photo-setting type silicone resin composition for solventless protecting and coating mounting circuit board comprises (A) a diorganopolysiloxane containing both ends terminated with silanol groups having 1-700cP viscosity at 25°C, (B) a (meth) acryloyloxy group containing alkoxysilane of formula I (R² is H or methyl; R³ is an alkylene; R⁴ and R⁵ are each independently monofunctional organic group; (a) is an integer of 0-2), (C) a bivalent tin compound of the formula SnX₂ (X is a halogen, etc.), (D) an ester-containing alkoxysilane compound of formula II (R⁸ and R⁹ are each independently methyl or ethyl; R¹⁰ and R¹¹ are each independently H or a monofunctional organic group; R¹² is a monofunctional organic group; (b) is an integer of 0-2), (E) a photopolymerization initiator and (F) a moisture-curing catalyst and has 20-500cP viscosity at 25°C. The component A is preferably a mixture of a component having ≥500cP viscosity at 25°C and a component having ≤100cP viscosity.;COPYRIGHT: (C)1996,JPO