BUMP-TOP DETECTING METHOD AND METHOD AND APPARATUS FOR MEASURING BUMP HEIGHT USING THE SAME

摘要

PROBLEM TO BE SOLVED: To accurately measure the bump height, even for deformed bumps having off-centered tops. ;SOLUTION: A hemispherical shell-like illumination 4 irradiates the surface of a semiconductor chip 10 with a light from the surrounding of the semiconductor chip 10 surface, a two-dimensional camera 3 picks up the image of the semiconductor chip 10 surface in the vertical direction, a parallel light illumination 2 irradiates the semiconductor chip 10 surface with a parallel light at an angle θ1 with respect to the semiconductor chip 10 surface, a one-dimensional camera 1 at a position opposite to the parallel light illumination 2 photographs the semiconductor chip 10 surface at an angle θ2 (=θ1), a moving stage 5 changes the position of the semiconductor chip 10 surface to be photographed by the one-dimensional camera 1, a length-measuring unit 6 measures the position of the photographed chip surface and an image processor 7 computes the height of a bump 12, based on images a, b and the position c of the photographed chip surface.;COPYRIGHT: (C)2001,JPO