DESIGN OF PRINTED WIRING PATTERN AND PRINTED WIRING BOARD SUBJECTED TO OUTLINE PUNCHING

摘要

PROBLEM TO BE SOLVED: To provide a printed wiring board which is free from cracks of the edge plane of outline punching and which improves the outline workability from the aspect of the pattern design. ;SOLUTION: In the outline punching process of a printed wiring board (including a build-up substrate) using a glass cloth as a base material, a copper pattern (3) smaller than a width of the groove which is to be punched is formed on the surface of the substrate of the groove, in order to eliminate a gap between the lower plane of the substrate (1) of the groove and the upper plane of a die 1a and then the groove where the copper pattern (3) is formed is punched (6) for outline processing.;COPYRIGHT: (C)2001,JPO