PRESSURE MODULATION METHOD TO OBTAIN IMPROVED STEP COVERAGE OF SEED LAYER

摘要

PROBLEM TO BE SOLVED: To provide a multi-step process for depositing a material into high aspect ratio features onto a substrate surface.;SOLUTION: The process includes steps for depositing a material on a substrate with a first pressure during a first period and then for depositing the material on the substrate with a second pressure during a second period. The modulation of the pressure affects the ionization and the track of particles that have been ionized under a plasma environment. The method of the invention in one aspect allows for optimum deposition at the bottom of a high aspect ratio frame during a high pressure step and increased deposition on the sidewalls of the feature during at least a low pressure step.;COPYRIGHT: (C)2001,JPO