Lead end grid array semiconductor package using the same grid and array-type lead frame

摘要

PROBLEM TO BE SOLVED: To reduce noise and increase the speed of signal transmission by making the lead ends constituting one end of leads constitute a grid array on the same plane within a certain lower region corresponding to the mounting region of a semiconductor chip. ;SOLUTION: In a lead 2 extended in X-axis direction, a direction converting lead part 2' is made on the same plane, and in a lead 2 extended in Y-axis direction, the ones where the direction converting lead parts 2' on the same plane are not made and the ones where they are made two or six are positioned alternately, and at each corner part, one lead end 4 is formed of two leads 2. The lead end 4 constitutes a grid array of alternate lateral row and longitudinal rows, being positioned in the specified position decided in advance on the same plane within a certain lower region corresponding to a semiconductor chip mounting region. Hereby, the signal transmission speed is increased by reducing the noise generated by signal interference phenomena.;COPYRIGHT: (C)1998,JPO