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DEVICE FOR SELECTIVELY SUPPLYING SPHERICAL HEAT-RESISTANT SUBSTANCE TO THROUGH HOLE OF PRINTED-WIRING BOARD, PRINTED-WIRING BOARD, AND MANUFACTURING METHOD THEREOF
DEVICE FOR SELECTIVELY SUPPLYING SPHERICAL HEAT-RESISTANT SUBSTANCE TO THROUGH HOLE OF PRINTED-WIRING BOARD, PRINTED-WIRING BOARD, AND MANUFACTURING METHOD THEREOF
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机译:通过印刷电路板,印刷电路板的孔选择性地供给球状耐热物质的装置及其制造方法
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摘要
PROBLEM TO BE SOLVED: To manufacturing a printed-wiring board having a through hole for gas-tight connection.;SOLUTION: Spherical heat-resistant substances 18 that have a diameter being larger than a middle-diameter through hole and being smaller than a large-diameter one are evenly supplied to a printed-wiring board 6 that has a small-diameter through hole 8 for continuity, a middle-diameter through hole 10 for gas-tight connection, and a large-diameter through hole 12 for lead insertion. The substances 18 are dropped except that they are partially inserted into the middle-diameter through hole. A resist for pressing the spherical heat- resistant substances that have been inserted into the middle-diameter through hole is formed on the printed-wiring board, the lead of parts with the lead is inserted into the large-diameter through hole for performing reflow soldering, and a press-fit pin forced into the middle-diameter through hole from the opposite side of the spherical heat-resistant substances that are retained by the middle-diameter through hole.;COPYRIGHT: (C)2001,JPO
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