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SENSOR MAIN BODY AND REVERSE-RESISTANT ENGINEERING PACKAGE AND ONE CHIP COMPUTER
SENSOR MAIN BODY AND REVERSE-RESISTANT ENGINEERING PACKAGE AND ONE CHIP COMPUTER
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机译:传感器主体和抗逆工程软件包和一芯片计算机
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摘要
PROBLEM TO BE SOLVED: To provide a sensor body and a reverse-resistant engineering package and a one chip computer for preventing sensor data from being intercepted in the middle of a path between a sensor device and an arithmetic unit such as an encipherment unit. ;SOLUTION: This sensor body is provided with a reverse-resistant engineering package for preventing inside structure analysis from the outside part or inside part analysis by physical disclosure, a sensor device in which any site other than a physical information fetching site is protected by the reverse-resistant engineering package, and an arithmetic unit protected by the reverse-resistant engineering package for performing a prescribed arithmetic operation, based on sensor data outputted by the sensor device.;COPYRIGHT: (C)2001,JPO
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