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SENSOR MAIN BODY AND REVERSE-RESISTANT ENGINEERING PACKAGE AND ONE CHIP COMPUTER

机译:传感器主体和抗逆工程软件包和一芯片计算机

摘要

PROBLEM TO BE SOLVED: To provide a sensor body and a reverse-resistant engineering package and a one chip computer for preventing sensor data from being intercepted in the middle of a path between a sensor device and an arithmetic unit such as an encipherment unit. ;SOLUTION: This sensor body is provided with a reverse-resistant engineering package for preventing inside structure analysis from the outside part or inside part analysis by physical disclosure, a sensor device in which any site other than a physical information fetching site is protected by the reverse-resistant engineering package, and an arithmetic unit protected by the reverse-resistant engineering package for performing a prescribed arithmetic operation, based on sensor data outputted by the sensor device.;COPYRIGHT: (C)2001,JPO
机译:解决的问题:提供一种传感器主体和耐反向工程封装,以及一种单芯片计算机,用于防止传感器数据在传感器设备与诸如加密单元之类的算术单元之间的路径中间被拦截。 ;解决方案:此传感器主体配备有抗反向工程包装,用于防止从外部进行内部结构分析或通过物理披露进行内部零件分析,传感器设备中除物理信息获取站点外的任何站点都受到保护。逆电阻工程套件,以及受逆电阻工程套件保护的运算单元,用于基于传感器设备输出的传感器数据执行规定的算术运算。;版权:(C)2001,JPO

著录项

  • 公开/公告号JP2001134494A

    专利类型

  • 公开/公告日2001-05-18

    原文格式PDF

  • 申请/专利权人 NIPPON TELEGR & TELEPH CORP NTT;

    申请/专利号JP19990313386

  • 发明设计人 HIRAGA TAKAICHI;

    申请日1999-11-04

  • 分类号G06F12/14;G06F9/06;

  • 国家 JP

  • 入库时间 2022-08-22 01:31:11

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