首页> 外国专利> METHOD AND DEVICE FOR MEASURING THICKNESS BY PHOTOTHERMAL ANALYSIS OF MATERIAL LAYER AND COMPUTER PROGRAM FOR PHOTOTHERMAL ANALYSIS

METHOD AND DEVICE FOR MEASURING THICKNESS BY PHOTOTHERMAL ANALYSIS OF MATERIAL LAYER AND COMPUTER PROGRAM FOR PHOTOTHERMAL ANALYSIS

机译:通过光热分析的材料层和计算机程序进行光热分析测量厚度的方法和装置

摘要

PROBLEM TO BE SOLVED: To provide a method and a device for photothermal analysis of materials layers, especially for thickness measurement thereof and also provide a computer program for photothermal analysis. ;SOLUTION: This device with the first layer of the materials which is a reference layer and the second layer which is a materials layer to be analyzed is for photothermal analysis, especially for the thickness measurement and is realized by the method with a computer program which consists of exciting the surface of the first layer of the materials by electromagnetic radiation, detecting the thermal radiation from the surface with the first temperature response curve, exciting the surface of the second layer of the materials, detecting the thermal radiation from the surface with the second temperature response curve. The extension factor is defined between the first and the second temperature response curves, and the extension factor is used as a fixed value of the rate between the materials layer for which the extension factor is analyzed and the reference layer.;COPYRIGHT: (C)2001,JPO
机译:解决的问题:提供一种用于材料层的光热分析,特别是用于其厚度测量的方法和装置,还提供一种用于光热分析的计算机程序。 ;解决方案:该设备的第一层材料是参考层,第二层是要分析的材料层,用于光热分析,尤其是厚度测量,并且通过计算机程序的方法实现。包括通过电磁辐射激发材料的第一层的表面,用第一温度响应曲线检测表面的热辐射,激发材料的第二层的表面,用电磁辐射检测表面的热辐射。第二温度响应曲线。扩展因子定义在第一和第二温度响应曲线之间,并且该扩展因子用作分析了扩展因子的材料层与参考层之间比率的固定值。;版权:(C) 2001年

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