SEMICONDUCTOR DEVICE HAVING Cu-BASED EMBEDDED WIRING AND PULSE PLATING METHOD OF Cu-BASED EMBEDDED WIRING

摘要

PROBLEM TO BE SOLVED: To perform Cu-based embedded wiring which is superior in adhesive ness and embedding at low cost, in a semiconductor device having Cu-based embedded wiring and a pulse plating method of Cu-based embedded wiring.;SOLUTION: A Cu alloy layer is provided between a barrier metal and an alloy composed of either Cu or an alloy whose main component is Cu.;COPYRIGHT: (C)2001,JPO