首页> 外国专利> PALLADIUM/IRON ALLOY PLATING SOLUTION AND PALLADIUM ALLOY PLATED BASE MATERIAL

PALLADIUM/IRON ALLOY PLATING SOLUTION AND PALLADIUM ALLOY PLATED BASE MATERIAL

机译:钯/铁合金镀层溶液和钯合金镀层基础材料

摘要

PROBLEM TO BE SOLVED: To provide a palladium alloy plating solution capable of applying white, bright plating good in glosiness, white and beautiful and excellent in corrosion resistance and thickening property instead of nickel plating having anxity of inducing metal allergy. ;SOLUTION: By a palladium/iron alloy plating solution containing conductive salt of 5 to 30 g/L, containing a soluble iron compound of 0.01 to 10 g/L expressed in terms of metallic iron, containing a soluble palladium compound of 1 to 30 g/L expressed in terms of metallic palladium, containing free ammonia of 1 to 50 g/L and a brightener of 0.1 to 30 g/L and whose pH is controlled to 7.0 to 12.0 by alkali hydroxide, white, bright plating which does not induce metal allergy, is beautiful in appearance and good in corrosion resistance can be obtained.;COPYRIGHT: (C)2001,JPO
机译:解决的问题:提供一种钯合金镀覆溶液,该镀覆溶液能够代替具有引起金属过敏的焦虑感的镍镀层,该镀层具有白色,亮丽的光泽,白色和美丽的外观,并且具有优异的耐腐蚀性和增稠性。 ;解决方案:钯/铁合金镀液中含有5至30 g / L的导电盐,含有以金属铁表示的0.01至10 g / L的可溶铁化合物,其中含有1至30的可溶钯化合物g / L,以金属钯表示,含有1至50 g / L的游离氨和0.1至30 g / L的增白剂,其pH值被碱金属氢氧化物控制为7.0至12.0,白色,没有光亮镀层引起金属过敏,外观美观,具有良好的耐蚀性。版权所有:(C)2001,日本特许厅

著录项

  • 公开/公告号JP2001181887A

    专利类型

  • 公开/公告日2001-07-03

    原文格式PDF

  • 申请/专利权人 BIKUTORIA:KK;

    申请/专利号JP19990367560

  • 发明设计人 AKAZA TOSHIYUKI;

    申请日1999-12-24

  • 分类号C25D3/56;C25D7/00;

  • 国家 JP

  • 入库时间 2022-08-22 01:28:38

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号