LAMINATED HEAT DISSIPATING MEMBER, POWER SEMICONDUCTOR DEVICE USING IT, AND METHOD OF PRODUCTION

摘要

PROBLEM TO BE SOLVED: To provide a laminated heat dissipating member comprising a bonded body of a metal based composite material and an insulating substrate imparted with a heat sink function excellent in heat dissipation properties and heat cycle characteristics in which cracking due to difference in the coefficient of thermal expansion between the insulating substrate, i.e., a heat dissipating plate, and the metal based composite material is substantially eliminated, a power semiconductor device comprising the laminated heat dissipating member and the laminated heat dissipating member, and a method for producing a power semiconductor device comprising the laminated heat dissipating member.;SOLUTION: The laminated heat dissipating member comprising the bonded body of the metal based composite material and the insulating substrate imparted with a heat sink function is produced by a method comprising a step for treating the bonding surface of the insulating substrate previously in order to ensure wettability to a soldering material or a metal, as required, a step for mounting ceramic particles previously surface treated in order to ensure wettability to the soldering material or the metal on the insulating substrate, a step for placing the soldering material on the ceramic particles, and a step for producing the metal based composite material reacted on the soldering material by thermally fusing the soldering material to make it permeate into the gap between the ceramic particles and bonding the metal based composite material to the insulating substrate.;COPYRIGHT: (C)2001,JPO