METHOD FOR BONDING THERMOPLASTIC RESIN MATERIAL AND BONDED STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a method for bonding a thermoplastic resin material with improved bonding force and to provide a bonded structure formed thereby. ;SOLUTION: The polyether-imide(PEI) film 12 to be bonded is disposed on a glass epoxy substrate 10 through an alkane film 20. While an adhesiveness improving layer 15 in which the alkane is dispersed is formed at the interface between the film 12 and the substrate 10 by heating the bonding part to the glass transition temperature Tg of the PEI or higher, the film 12 is bonded to the substrate 10.;COPYRIGHT: (C)2001,JPO