首页> 外国专利> SUBSTRATE-HOLDING METAL CASE, SUBSTRATE-HOLDING STRUCTURE USING THE METAL CASE, AND MANUFACTURE FOR ELECTRONIC EQUIPMENT USING THE METAL CASE

SUBSTRATE-HOLDING METAL CASE, SUBSTRATE-HOLDING STRUCTURE USING THE METAL CASE, AND MANUFACTURE FOR ELECTRONIC EQUIPMENT USING THE METAL CASE

机译:基板保持金属壳体,使用该金属壳体的基板保持结构,以及使用该金属壳体的电子设备的制造

摘要

PROBLEM TO BE SOLVED: To fully obtain mechanical strength and electromagnetic shield effects of a metal case, without causing increase in the weight of the metal case and increase in the number of part items in a metal case for accommodating and holding a printed wiring substrate, a substrate-holding structure using this metal case, and further a manufacture for electronic equipment using this metal case. ;SOLUTION: A shield plate 22 is arranged in a metal case 2 of an electronic tuner. A foot part 4 having a frontal end of a spear type is formed in the lower end part of the shield plate 22. A cutout 45 is formed at the center of the foot part 4 to be divided into two parts. After the foot part 4 is inserted into the opening of a printed wiring substrate 3, the foot part 4 is unfolded to solder in a state in which the foot part 4 made to come into contact with a grounding conductor 35.;COPYRIGHT: (C)2000,JPO
机译:要解决的问题:为了充分获得金属外壳的机械强度和电磁屏蔽效果,而又不增加金属外壳的重量和增加用于容纳和固定印刷线路板的金属外壳中零件的数量,使用该金属壳体的基板保持结构,以及使用该金属壳体的电子设备的制造。 ;解决方案:屏蔽板22布置在电子调谐器的金属外壳2中。在屏蔽板22的下端部形成有具有矛状的前端的脚部4。在脚部4的中央形成有切口45,将其分为两部分。将脚部4插入印刷布线基板3的开口后,在使脚部4与接地导体35接触的状态下,将脚部4展开并焊接。 2000年

著录项

  • 公开/公告号JP2000332451A

    专利类型

  • 公开/公告日2000-11-30

    原文格式PDF

  • 申请/专利权人 SHARP CORP;

    申请/专利号JP19990135754

  • 发明设计人 GOTO KAZUHIKO;

    申请日1999-05-17

  • 分类号H05K5/04;H05K9/00;

  • 国家 JP

  • 入库时间 2022-08-22 01:26:51

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